As portable products become smaller and more complex, the space available for protection circuits on printed circuit boards (PCBs) is shrinking. Conversely, with increasing functionality and power-on capabilities, the peak surge currents that protection circuits need to withstand are growing. Ensuring high peak surge current tolerance within a small package requires not only advanced semiconductor chip design but also improvements in package reliability and heat dissipation.

To achieve a small package, high surge current tolerance, and high package reliability, Huayue Semiconductor has launched the HSESD0541P0-N product. This product utilizes a new PLP packaging technology, enabling the placement of a large-area chip within a limited package area. Copper microvia interconnect technology increases the contact area between the chip and the interconnects. Wet copper etching technology replaces traditional wire bonding, reducing impedance introduced by the package and maximizing space utilization for heat dissipation, ensuring strong performance even in a small chip package. Simultaneously, the device's lead pads use a nickel-gold process, effectively improving the soldering reliability of the DFN0603(0201) device.

The Huayue Core HSESD0541P0-N device, a bidirectional TVS, is packaged in a DFN0603 (0201) package. With a maximum operating voltage of 5V, it requires minimal space to support an IPP up to 22A, with a typical clamping voltage of 9V. This solution supports electrostatic discharge testing up to 30KV, and its low clamping voltage ensures superior surge and electrostatic protection. The device's junction capacitance is typically 30pF, meeting most requirements for DC ports and low-to-medium frequency communication applications.

As a power device and EMC solutions provider, Huayue Core is committed to finding the most suitable solutions for its customers, providing the most reliable material selection guidance, and delivering the most perfect chip parameters and quality. We strive to explore superior chip and packaging designs, discover innovation, and offer customers better choices.

Recommended applications for HSESD0541P0-N: Network set-top boxes, optical modules, portable instruments, handheld devices, instrumentation, industrial inspection cameras, base station RF modules, and medical instruments.